The SEM series baking process equipment has advanced cleaning technology, low oxygen, rapid circulation curing adhesives and polymers for large-scale semiconductor packaging and assembly. Applications include wafer level aging, chip bonding, curing of wire and chip bonding with imide adhesive protection, aging, and reliability testing.
We have successfully solved many technical challenges in heat treatment of capacitors, resistors, and other electronic components for the VAC series vacuum process equipment. Applications include low-temperature drying, defoaming of LCD panels, vacuum moisture analysis treatment of target materials, pyrolysis, curing, baking of ceramic capacitors, stress relief, HMDS chip vapor phase coating, and other applications